CSSC Chengxi and BoComm Leasing signed 8 chip carrier construction contracts

On June 25, CSSC Chengxi Shipyard and BoComm Leasing signed a contract for the construction of 8 chip carriers in Shanghai, including 6 64,000DWT chip carriers and 2 70,000DWT chip carriers.
 
In 2017, the two parties signed a contract for the construction of two 82,000DWT bulk carriers, officially opening the prelude to the cooperation. Before the signing of this contract, in a short period of 4 years, 16 ships have been signed successively.
 
At the same time, the signing of the construction contracts for 8 chip carriers further enriched the shipbuilding orders in hand by CSSC Chengxi, and laid the foundation for the continuous and stable production start.
 
Source: Sarah Yu, XINDE MARINE NEWS

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